Magnetron Sputtering

Principle:
In a vacuum chamber, gas ions generated by glow discharge (such as Ar⁺) are accelerated by an electric field to bombard a solid target material. The target atoms are ejected through this impact process and deposited onto the substrate to form a thin film. To improve efficiency, a magnetic field is applied behind the target to confine electrons near the target surface, greatly increasing the collision probability with gas molecules.